Smithers can simulate commercial adhesive bonding processes in the laboratory, allowing packaging adhesives and substrates to be evaluated without the need for disruptive production-line trials.
Testing can control key bonding parameters including:
- Open time
- Contact time
- Adhesive application weight
- Contact pressure
- Adhesive temperature
- Application speed
The strength of the resulting adhesive joint can then be measured under different pre-set conditions. This enables different combinations of adhesive, substrate and process parameters to be compared and can help identify suitable operating conditions for an application.
Testing is particularly applicable to hot-melt packaging adhesives and can support adhesive selection, process optimisation and investigation of bonding performance issues.
Prepared adhesive bonds can also be evaluated for long-term creep and heat resistance where required.
Talk to our experts about your adhesive, substrate or bonding process and the performance you need to evaluate.
